HCLTech has been selected as a Design Solution Partner (DSP) under the Samsung Advanced Foundry Ecosystem (SAFE™) program, marking a strategic alliance aimed at accelerating semiconductor innovation. This collaboration leverages HCLTech’s deep expertise in engineering and R&D services alongside Samsung’s state-of-the-art semiconductor manufacturing processes to enhance chip design and development efficiency.

As part of the SAFE™-DSP initiative, HCLTech will provide comprehensive ASIC (Application-Specific Integrated Circuit) design services to semiconductor companies seeking to utilize Samsung Foundry’s cutting-edge technologies. This partnership is set to optimize chip development, reducing time-to-market for next-generation silicon solutions.

Samsung will extend specialized training and technical support to HCLTech engineers, equipping them with advanced semiconductor knowledge. Additionally, HCLTech will gain access to Multi-Project Wafer (MPW) programs, facilitating efficient prototyping and streamlined production of semiconductor solutions.

Taejoong Song, Vice President at Samsung Electronics, highlighted the shared vision behind this collaboration, stating, “This partnership reinforces our joint commitment to innovation, enabling faster development of next-generation semiconductor technologies.”

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Sanjay Gupta, Corporate Vice President of Strategic Initiatives at HCLTech, emphasized the growing importance of semiconductor advancements, saying, “By harnessing the strengths of HCLTech and Samsung Foundry, we aim to push the boundaries of semiconductor technology and meet the evolving demands of global markets.”

This announcement follows HCLTech’s recent partnership with Western Union, where the company is implementing an AI-driven platform model to enhance financial services. This move cements HCLTech’s position as Western Union’s largest preferred technology partner, underscoring its expertise in digital transformation, platform innovation, and operational efficiency.

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